Rigaku metrology solutions address process requirements for film thickness and composition. Here we describe different analytical approaches to characterize PRAM (GST) materials by WDXRF versus XRR & EDXRF.
WDXRF
General features of Rigaku WDXRF systems, like the AZX 400, are shown below.
WDXRF generally provides higher energy resolution than EDXRF to minimize peak overlaps.
EDXRF & XRR
Rigaku's XTRAIA MF-3000 (MFM310) employs three COLORS monochromatic beam modules for EDXRF measurements of light, transition, and heavy elements. EDXRF measurements can be made over a range of incidence angles, and the ability to perform grazing incidence XRF measurements enhances sensitivity for ultrathin films.
SUMMARY
Rigaku offers a range of metrology solutions for PRAM (GST) and other memory materials.
| Thickness | Composition | Density | |
| MFM | XRR | XRF (Calibration Curve) | XRR |
| AZX | FP | FP | - |
| Throughput (Blanket) | Spot Size | XRF Energy Overlap | |
| MFM | 10~15min/5pts | <85μm (FWHM) |
Analysis method: Pattern Fitting (to separate Sb and Te peaks) |
| AZX | 15~20min/5pts | 10mm (Diaphragm) | None |
| Wafer | |
| MFM | Blanket and patterned |
| AZX | Blanket |
| Automation | |
| MFM | GEM-300 compatible |
| AZX | Off line |
