SEMICONDUCTOR METROLOGY APPLICATIONS

MEMORY

Address process requirements for film thickness and composition, surface contamination monitoring, and process requirements for film thickness and composition.

Explore Memory Application Semiconductor Metrology Solutions

PRAM (GST) Analyze film thickness and composition process requirements. Here we describe different analytical approaches to characterize PRAM (GST) materials by WD-XRF versus XRR and ED-XRF.

POWER DEVICES

Monitor metal film thickness and uniformity with high precision and throughput.

Explore Power Device Application Semiconductor Metrology Solutions

• Power Device Back Side Electrode Thickness by WDXRF
• Surface Contamination of (SiC, GaN) Power Device Wafers by TXRF
• Evaluation of Wet Cleans in SiC Power MOSFET Fabrication by TXRF

MEMS

• Evaluation of MEMS Device Materials by WDXRF
• Thickness & Composition of Piezoelectric PZT Films by WDXRF
• Composition Mapping of a PZT Sputtering Target by WDXRF 

ADVANCED PACKAGING

• UBM/RDL - Thickness & Composition
• Bump Inspection - Composition & Height
• Pd Measurement on GaAs Wafer 

COMPOUND SEMICONDUCTOR

X-ray Metrology solutions for emerging power electronics devices, optoelectronics, 5G, and 6G communications.

SiC, GaN, GaAs, InP, Ga²O³