Rigaku PRAM (GST) Metrology Solutions

Rigaku metrology solutions address process requirements for film thickness and composition. Here we describe different analytical approaches to characterize PRAM (GST) materials by WDXRF versus XRR & EDXRF.

 

WDXRF

General features of Rigaku WDXRF systems, like the AZX 400, are shown below.

WDXRF generally provides higher energy resolution than EDXRF to minimize peak overlaps. 

 EDXRF & XRR

Rigaku's XTRAIA MF-3000 (MFM310) employs three COLORS monochromatic beam modules for EDXRF measurements of light, transition, and heavy elements.  EDXRF measurements can be made over a range of incidence angles, and the ability to perform grazing incidence XRF measurements enhances sensitivity for ultrathin films.

SUMMARY

Rigaku offers a range of metrology solutions for PRAM (GST) and other memory materials.

 

  Thickness Composition Density
MFM XRR XRF (Calibration Curve) XRR 
AZX FP FP -

 

  Throughput (Blanket) Spot Size XRF Energy Overlap
MFM 10~15min/5pts <85μm (FWHM)

Analysis method:

Pattern Fitting (to separate Sb and Te peaks)

AZX 15~20min/5pts 10mm (Diaphragm) None

 

  Wafer
MFM Blanket and patterned
AZX Blanket

 

  Automation
MFM GEM-300 compatible
AZX Off line

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AZX 400

Image - AZX 400 - with autoloader 800x610

SEQUENTIAL WDXRF SPECTROMETER FOR PROCESS R&D AND LOW-VOLUME /  HIGH-PRODUCT-MIX MANUFACTURING

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...for MTJ Layer Thickness & Composition

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XTRAIA MF-3000 (MFM310)

Image - MFM310 - 800x610 - 2018-12-11

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