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WD-XRF APPLICATION

 THICKNESS CHARACTERIZATION OF A POWER DEVICE

BACKSIDE ELECTRODE

WD-XRF can monitor metal film thickness and uniformity with high precision and throughput.

 

All four layers, even the bottom Al, can be analyzed simultaneously thanks to the high-power (4 kW) X-ray source and the FP method.

elements measeured by wd-xrf

 

X                     Y Au Ni Ti Al
nm nm nm nm
Average (nm) 49.3 551.3 198.2 89.5
Maximun (nm) 50.4 557.3 201.2 91.1
Minimun (nm) 48.1 544.8 195.3 87.9
Range (nm) 2.3 12.5 5.9 3.23
Sigma (nm) 0.90 3.59 1.61 0.87
RSD (%) 1.82 0.65 0.81 0.97

 

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