BUMP INSPECTION - COMPOSITION & HEIGHT

The hybrid solution provides quick and reliable location of bump and wafer defects

The hybrid solution provides a quick and reliable location of bump and wafer defects. The bump, a dome-like structure made of solderable material, is a crucial interconnecting element for connecting chips in a three-dimensional stack and for connecting the stack to the printed circuit board.

  • Elemental composition analysis by optical analysis for geometrical parameters and XRF
  • Vertical incident X-Ray beam (spot down to 7 µm on Sn K line) using four independent detectors configured in a symmetric assembly
  • Thickness/composition extraction using robust Fundamental Parameters (FP) algorithm
  • Composition analysis using Standardless Fundamental Parameter (SLFP) option

 

bump inspection image1

 

RIGAKU RECOMMENDS

Onyx 3000 Hybrid EDXRF and OPTICAL Metrology Fab Tool

BAK_0579 V2

Thickness, composition, defect identification and sizing of films and structures on blanket and patterned wafers

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