UBM/RDL: THICKNESS & COMPOSITION MONITORING

Analysis of multi-stack structures and thick mono-layers

Multi-stack structures and thick mono-layers are efficiently analyzed by XRF for layer thickness and composition whereas optical metrology technologies are not capable of simultaneously distinguishing between separate layers, which necessitates measuring each layer before application of the next layer.

Other X-ray techniques such as XRR are not capable of measuring non-planar structures.

  • Multi stack analysis in one shot
  • CuNiPd / CuNiAu / CuNiZn
  • High-throughput performance
  • Multi-element detection is discrete
  • Robust fundamental parameter algorithm for thickness extraction

 

ubm rdl bump image

 

RIGAKU RECOMMENDS

Onyx 3000 Hybrid EDXRF and OPTICAL Metrology Fab Tool

BAK_0579 V2

Thickness, composition, defect identification and sizing of films and structures on blanket and patterned wafers

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