SCHEDULE A DEMO - Onyx 3000
FEATURES & BENEFITS
- Micro-spot X-ray beam and pattern recognition
- 2D- and 3D- optical characterization of device structures
- High-throughput, blanket- and product-wafer measurements
- Wide range of materials and applications
- Metal film stacks thickness measurements
- Feature dimensions measuring
- Detection and analysis of voids or missing layers
- High resolution and precision covering thicknesses from Ångstroms to microns
- Helium purged measurement environment for light-element sensitivity
- Configurable for 300mm and smaller wafers