Rigaku Logo 100px
XTRAIA MF-2000 Transparent

XTRaIA® MF-2000

PROCESS ED-XRF, xrr, AND XRD

METROLOGY FAB TOOL

DOWNLOAD BROCHURE

XRR, ED-XRF, XRD METROLOGY OPTIMIZED FOR HIGH-VOLUME MANUFACTURING

TECHNICAL SPECIFICATIONS

The Rigaku XTRAIA MF-2000 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultra-thin single-layer films to multi-layer stacks.

 

Designed for high-volume manufacturing

The XTRAIA MF-2000 is designed with high-volume 200 mm (and smaller wafer) manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and SEMI S2/S8 Compliance for semiconductor production clean room operation, SECS/GEM, high-reliability machine performance and low power consumption and cost of ownership. Available with open cassette and SMIF pod configurations.

 

Film thickness and density monitor

The XTRAIA® MF-2000 is equipped with a HyPix 3000, two-dimensional, direct photon-counting detector for XRR and XRD measurements with multiple modes (0D, 1D, 2D) of operation. This detector has ~300,000 pixels with a 100 µm x 100 µm pixel size. When an X-ray photon is an incident, each pixel sensor becomes conductive and can count the number of incident photons one by one.

 

XRR detection is five times faster

High resolution and high dynamic range (108) enable XRR to characterize a wide range of film thicknesses, from ultra-thin film (sub-nm) to thick film (450 nm)

Using a two-dimensional detector and X-ray reflectivity (XRR) measurement, the measurement speed of the XTRAIA® MF-2000 has been improved five times compared with the conventional model.

 

Microcrystalline thin films with low crystallinity

In addition, XRR and X-ray diffraction (XRD) capability enable the measurement of very thin and low- crystallinity films, for which the demand is increasing.

FEATURES & BENEFITS

  • Micro-spot, monochromatic X-ray beams, and pattern recognition
  • High-throughput, product-wafer measurements
  • Wide range of materials and applications
  • High resolution and precision covering thicknesses from Ångstroms to microns
  • For 200 mm (and smaller) wafers with open cassette and SMIF load port configurations
  • Available with SECS/GEM communication
  • Design based on SEMI S2 and SEMI S8

 

SYSTEM PARAMETERS

SPECIFICATIONS

Technique

Energy dispersive X-ray fluorescence (ED-XRF), Micro x-ray fluorescence (µXRF), and X-ray reflectivity (XRR)

Benefit

High-throughput Measurement of Product Wafers From Ultra-thin Films to Micron-order Films, Applicable to a Wide Range of Thickness and Film Types.

Technology

Analytical flexibility to measure

Core attributes

Monochromatic, micro-spot X-ray beam modules (COLORS™) enables a choice of optimized X-ray sources.

Core options

Ultra-fast detector with up to 108 dynamic range and with monochromatic, micro-spot X-ray sources. Wafer Loader.

Computer

External PC, MS Windows® OS

Core dimensions

1612(W)×3395(D)×2118(H)mm 

Power requirements

3-phase, 208 V, 20 A, avg. 2 kVA

 

 

COLORS™ enabling technology

Rigaku developed COLORS™ X-ray optics for the XTRAIA® MF-2000, enabling measurements from small areas. COLORS™ beam modules couple X-ray tube sources with optimized optics to provide monochromatic, high-brightness illumination in small spots for various thin film applications. With its own X‑ray optics business, Rigaku is well-positioned to develop and manufacture X-ray sources for current and future market needs.

Colors beams

TECHNICAL SPECIFICATIONS

FRONT OFF LINE APPLICATIONS

end OFF LINE APPLICATIONS

other APPLICATIONS

  • XRR/XRF Combo Measurement of SiGe Composition in Fin Gate
  • Thickness Measurement of Ultra-thin Films Down to 1 nm
  • Multi-layer Dielectric Film Measurement
  • SiGe, CoSix, NiSix, SOl, Al, SiON, Hi-k dielectric/ metal gate
  • Ultra-thin Lanthanum Film Measurement
  • Cu seed, Cu barrier, Cu plating, Ti/TiN, Ta/TaN, W

 

 

  • XRF Measurement of Thickness Variation in MRAM Process
  • XRR Measurement of Physical Characteristics in MTJ Stack
  • MgO, CoFeB, Ru, Pt, PZT

 

TRUSTED PARTNER

WHO WE ARE
Pharmaceuticals have the power to change the world for the better, but before they can ever do that, they need to be proven safe and trustworthy. Here at Rigaku, we strive to make this a reality as the leading global scientific analytical instrumentation company specializing in X-ray and thermal analysis, and Raman spectroscopy.

CORPORATE MISSION
To contribute to the enhancement of humanity through scientific and technological development.

CORPORATE MOTTO
Value our customers, value our people, and value our technology

 

Rigaku Yamanashi Japan BNW
Rigaku Yamanashi Factory - Japan

Who we are

Rigaku Semiconductor Metrology Division

Semiconductors have the power to change the world for the better. Here at Rigaku, we strive to make this a reality as the leading global supplier of X-ray metrology tools for semiconductor process R&D and high-volume manufacturing.

 
CORPORATE MISSION
To contribute to the enhancement of humanity through scientific and technological development.
 
CORPORATE MOTTO
Value our customers, value our people, and value our technology.