XTRAIA MF-2000

The Rigaku XTRAIA MF-2000 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.

Designed for high-volume manufacturing

The XTRAIA MF-2000 is designed with high-volume 200 mm (and smaller wafer) manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance for semiconductor production clean room operation, compliance with SECS/GEM, high-reliability machine performance and low power consumption and cost of ownership. Available with open cassette and SMIF pod configurations.

COLORS™ enabling technology

COLORS™ X-ray optics were developed by Rigaku for the XTRAIA MF-2000 to enable measurements from small areas. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications. With its own x-ray optics business, Rigaku is well-positioned develop and manufacture X-ray sources for current and future market needs.

FEATURES & BENEFITS

• Micro-spot X-ray beams and pattern recognition

• High-throughput, product-wafer measurements

• Wide range of materials and applications

• High resolution and precision covering thicknesses from Ångstroms to microns

• For 200 mm (and smaller) wafers with open cassette and SMIF load port configurations

• Available with SECS/GEM communication

• Design based on SEMI S2 and SEMI S8