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TXRF 3800e

TXRF 3800e

WAFER SURFACE CONTAMINATION

COMPACT SPECTROMETER FOR UP TO 200 mm WAFERS

MEASURE ELEMENTAL CONTAMINATION  AT DISCRETE POINTS OR WITH FULL WAFER MAPS

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TECHNICAL SPECIFICATIONS

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3800e can measure elements from S through U with a single-target, dual-beam X-ray system, and a new liquid nitrogen-free detector system.

 

The TXRF 3800e includes the Rigaku patent pending X-Y-θ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. These contribute to higher throughput, accuracy and precision, and easy routine operation.

 

Optional Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots" — out to zero edge exclusion.

 

These features are housed in a new, compact, and efficient design. Access for all maintenance work is through the front, and rear panels, so other cleanroom equipment may be placed next to the TXRF 3800e. This represents a significant savings expense for clean-room space.

 

 

 

 

 

 

 

FEATURES & BENEFITS

  • Ease of operation and rapid analysis results
  • Accepts 200 mm and smaller wafers
  • Low cost of ownership
  • Compact design, footprint
  • Sealed X-ray tube source
  • Wide range of analytical elements (S~U)
  • Application to bare Si and to non-Si substrates
  • Zero edge exclusion (ZEE-TXRF) measurement capability
  • Import measurement coordinates from defect inspection tools for follow-up analysis

 

 

SYSTEM PARAMETERS

SPECIFICATIONS

Technique Total reflection X-ray fluorescence (TXRF)
Benefit Rapid elemental analysis, of S to U, to gauge wafer contamination in all fab processes
Technology Dual-beam TXRF system with liquid nitrogen-free detector
Core attributes Up to 200 mm wafers, XYθ sample stage system, in-vacuum wafer robotic transfer system
Core options SECS/GEM communication software. Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots"
Computer Internal PC, MS Windows® OS
Core dimensions 1000 (W) x 1760 (H) x 948 (D) mm
Mass 100 kg (core unit)
Power requirements 3Ø, 200 VAC 50/60 Hz, 100 A

APPLICATIONS

LOWER LIMIT OF DETECTION (LLD) EXAMPLES OF SPECIFIC ELEMENTS

 

Atoms/cm2 Na Al Fe Ni Cu
TXRF 3800e - - 2.1x109 1.8x109 1.9x109

Applications

Si, SiC, GaN, Ga2O3, Diamond (...)

TRUSTED PARTNER

WHO WE ARE
Pharmaceuticals have the power to change the world for the better, but before they can ever do that, they need to be proven safe and trustworthy. Here at Rigaku, we strive to make this a reality as the leading global scientific analytical instrumentation company specializing in X-ray and thermal analysis, and Raman spectroscopy.

CORPORATE MISSION
To contribute to the enhancement of humanity through scientific and technological development.

CORPORATE MOTTO
Value our customers, value our people, and value our technology
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