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TXRF 3760

TXRF 3760

WAFER SURFACE CONTAMINATION

FOR UP 200 mm WAFERS

COMPACT spectrometer

MEASURE ELEMENTAL CONTAMINATION

AT DISCRETE POINTS OR WITH FULL WAFER MAPS

DOWNLOAD BROCHURE

TECHNICAL SPECIFICATIONS

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system, and a liquid nitrogen-free detector system.

 

The TXRF 3760 includes Rigaku's patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly Windows software. These contribute to higher throughput, accuracy and precision, and easy routine operation.

 

Optional Sweeping TXRF software enables mapping the contaminant distribution over the wafer surface to identify "hot spots" that can be automatically re-measured at higher precision.

 

Optional ZEE-TXRF capability overcomes the historical 15 mm edge exclusion of original TXRF designs, enabling measurements to be made with zero edge exclusion.

 

HIGH-RELIABILITY WAFER SURFACE CONTAMINATION ANALYSIS


Total Reflection X-ray Fluorescence (TXRF) is an indispensable tool for materials and device development for semiconductor manufacturing. Remarkable reliability is achieved thanks to newly developed X-ray optics, a new stage mechanism, and a new concept in compact rotating-anode X-ray sources. Also, a new, low-COO TXRF model offers reduced initial and operating costs.

FEATURES & BENEFITS

  • Ease of operation and rapid analysis results
  • Accepts 200 mm and smaller wafers
  • Compact design, footprint
  • High-power rotating-anode source
  • Wide range of analytical elements (Na~U)
  • Light-element sensitivity (for Na, Mg, and Al)
  • Application to bare Si and to non-Si substrates
  • Import measurement coordinates from defect inspection tools for follow-up analysis

 

SYSTEM PARAMETERS

SPECIFICATIONS
Technique Total reflection X-ray fluorescence (TXRF)
Benefit Rapid elemental analysis, of Na to U,  to gauge wafer contamination in all fab processes
Technology 3-beam TXRF system with liquid nitrogen-free detector
Core attributes Up to 200 mm wafers, XYθ sample stage system, in-vacuum wafer robotic transfer system, ECS/GEM communication software
Core options Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots." ZEE-TXRF capability enabling measurements to be made with zero edge exclusion
Computer Internal PC, MS Windows® OS
Core dimensions 1000 (W) x 1760 (H) x 948 (D) mm
Mass 100 kg (core unit)
Power requirements 3Ø, 200 VAC 50/60 Hz, 100 A

APPLICATIONS

LOWER LIMITS OF DETECTION (LLD) OF TXRF *1

Measurement time: 1000 sec Unit: atoms/cm2    1 Typical Value 2 In case of film-type contamination

Atoms/cm2 Na Al Fe Ni Cu
TXRF 3760 2.5x1011*12 2.5x1011*2 1.0x109 1.0x109 1.5x109

APPLICABLE TO A VARIETY OF WAFERS AND APPLICATIONS

Si, SiC, GaN, Ga2O3, Diamond (...)

The application of Total-reflection X-ray Fluorescence analysis is not limited to the analysis of metallic contamination on bare silicon wafers.
TXRF analysis can be applied to gauge the cleanness of all fab processes, including cleaning, lithography, etching, ashing, films, etc.
Beyond silicon devices, this technique is also applicable to the fields of SiC power devices, compound semiconductors, MEMS, organic lectroluminescent materials, etc.

Rigaku Corporation


3-9-12, Matsubara-cho
Akishima-shi, Tokyo
196-8666, Japan 
E-mail address info-gsm@rigaku.co.jp
Phone number +81 3-3479-0618

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The Woodlands, TX
77381-5209, USA
E-mail address info@rigaku.com
Phone number +1-281-362-2300

Rigaku Europe SE


Hugenottenallee 167
Neu-Isenburg
63263 , Germany
E-mail address semieurope@rigaku.com
Phone Number +49 6102 77999 51

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WHO WE ARE
Pharmaceuticals have the power to change the world for the better, but before they can ever do that, they need to be proven safe and trustworthy. Here at Rigaku, we strive to make this a reality as the leading global scientific analytical instrumentation company specializing in X-ray and thermal analysis, and Raman spectroscopy.

CORPORATE MISSION
To contribute to the enhancement of humanity through scientific and technological development.

CORPORATE MOTTO
Value our customers, value our people, and value our technology