Onyx 3000

IN-LINE NON-DESTRUCTIVE INSPECTION AND METROLOGY FOR THE SEMICONDUCTOR AND MICRO-ELECTRONIC INDUSTRIES

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THICKNESS, COMPOSITION, DEFECT IDENTIFICATION AND SIZING OF FILMS AND STRUCTURES ON BLANKET AND PATTERNED WAFERSBlue Accent Line

Combining advanced X-ray and optical techniques, the Onyx 3000 offers unique metrology approaches in many areas from FEOL through WLP leading to in-line solutions for these processes. This sophisticated hybrid metrology tool makes it practical to perform high-throughput, in-line measurements on blanket and product wafers ranging from ultrathin single-layer films to multilayer stacks. 2D- and 3D- optical microscopy enables defect detection in and characterization of BEOL structures through image analysis (of color, height, roughness, etc. of metal stacks, solder bumps, pillars, etc.) complemented by elemental composition and thickness measurements by XRF analysis.

DESIGNED FOR HIGH-VOLUME MANUFACTURING

The Onyx 3000 is designed with high-volume manufacturing in mind: high-throughput thickness and composition measurements by XRF, rapid 2D- and 3D- optical inspection, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, S2/S8 compliance for semiconductor production clean room operation, SECS/GEM communication software, high-reliability machine performance and low power consumption and cost of ownership.

Polycapillary And COLORS™ Enabling Technology

The Onyx 3000 is offered with micro-spot, polycapillary X-ray optics and optionally with Rigaku’s monochromatic COLORS™ X-ray optics. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications.

FEATURES & BENEFITS

  • Micro-spot X-ray beam and pattern recognition
  • 2D- and 3D- optical characterization of device structures
  • High-throughput, blanket- and product-wafer measurements
  • Wide range of materials and applications
  • Metal film stacks thickness measurements
  • Feature dimensions measuring
  • Detection and analysis of voids or missing layers
  • High resolution and precision covering thicknesses from Ångstroms to microns
  • Helium purged measurement environment for light-element sensitivity 
  • Configurable for 300mm and smaller wafers
  • Design based on SEMI S2 and SEMI S8

EXPLORE CAPABILITIES

Light-Element Detection
Film Stack Measurement
Real Time Review
Feature Detection & Metrology

TRUSTED PARTNER

WHO WE ARE
Semiconductors have the power to change the world for the better, but before they can ever do that, they need to be proven reliable. Here at Rigaku, we strive to make this a reality as the leading global scientific analytical instrumentation company specializing in X-ray and thermal analysis, and Raman spectroscopy.

CORPORATE MISSION
To contribute to the enhancement of humanity through scientific and technological development.

CORPORATE MOTTO
Value our customers, value our people, and value our technology
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