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XTRAIA MF-2000 Transparent

X-RAY METROLOGY IN YOUR TOOLBOX

TXRF | WD-XRF | ED-XRF | XRR | HR-XRD | CD-SAXS

SEMICONDUCTOR METROLOGY TOOLS

Cutting-edge Metrology Solutions for semiconductor R&D and high-volume manufacturing

We are contributing to the enhancement of humanity through scientific and technological development.

Non-destructive analysis

Rapid data collection

High sensitivity to surface contamination

High Throughput

High Precision

Mapping analysis

Thickness and Composition Analysis

Thin Film Metrology

APPLICATIONS of x-ray metrology in semiconductor manufacturing

IS SURFACE CONTAMINATION AN ISSUE FOR YOUR PROCESS?

WAFER SURFACE CONTAMINATION ANALYSIS

≤ 200 mm Metrology Solutions

TXRF 3800e | Surface contamination typically metals

TXRF 3760 | Surface contamination typically metals

ARE YOU DEALING WITH METAL FILMS, OR ARE YOU INTERESTED IN CHARACTERIZING LIGHT ELEMENTS?

≤ 200 mm Metrology Solutions

WDA-3650 | Wafer/disk analyzer simultaneous WD-XRF spectrometer

XHEMIS® EX-2000 | ED-XRF and XRR for blanket metal layer thickness and composition

XTRAIA® MF-2000 | ED-XRF and XRR for blanket  and patterned metal layer thickness and composition

 

≤ 300 mm Metrology Solutions

TXRF310Fab | TXRF Surface contamination typically metals

TXRF-V310 | Simultaneous VPD and TXRF for the highest throughput

WaferX 310 |  Simultaneous WD-XRF spectrometer

XTRAIA® MF-3000 | ED-XRF and XRR for blanket  and patterned metal layer thickness and composition

 

≤ 400 mm Metrology Solutions

AZX 400 | Sequential WD-XRF spectrometer for wafers, media disks, and large samples

 

IS WAFER-LEVEL PACKAGING AN ISSUE FOR YOUR SEMICONDUCTOR MANUFACTURING PROCESS?

BUMP INSPECTION SYSTEM

≤ 300 mm Metrology Solutions

ONYX 3000Hybrid metrology, XRF and optical x-ray, with  a 2D microscope, and 3D Scanner for blanket and patterned wafer thickness, composition, defect identification, and sizing

 

  • Hybrid Configuration
  • Micro-spot ED-XRF and 2D- and 3D- optical characterization of device structures
  • For FEOL, BEOL, and packaging applications
  • For up to 300 mm blanket and patterned wafers

ARE YOU INTERESTED IN CHARACTERIZING PATTERNED WAFERS WITH REPEATED STRUCTURES?

X-RAY CD METROLOGY TOOLS FOR GRAZING INCIDENT AND TRANSMISSION MEASURMENTS

≤ 300 mm Metrology Solutions

XTRAIA® CD-3000G | XRR for thickness, density, and roughness, GI-SAXS for CD measurements

XTRAIA® CD-3000T | T-SAXS for In-line small-angle x-ray scattering for CD measurements

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Rigaku Yamanashi Japan BNW
Rigaku Yamanashi Factory - Japan

Who we are

Rigaku Semiconductor Metrology Division

Semiconductors have the power to change the world for the better. Here at Rigaku, we strive to make this a reality as the leading global supplier of X-ray metrology tools for semiconductor process R&D and high-volume manufacturing.

 
CORPORATE MISSION
To contribute to the enhancement of humanity through scientific and technological development.
 
CORPORATE MOTTO
Value our customers, value our people, and value our technology.