
X-RAY METROLOGY IN YOUR TOOLBOX
TXRF | WD-XRF | ED-XRF | XRR | HR-XRD | CD-SAXS
SEMICONDUCTOR METROLOGY TOOLS
Cutting-edge Metrology Solutions for semiconductor R&D and high-volume manufacturing
We are contributing to the enhancement of humanity through scientific and technological development.
-
Non-destructive analysis
-
Rapid data collection
-
High sensitivity to surface contamination
-
High Throughput
-
High Precision
-
Mapping analysis
-
Thickness and Composition Analysis
-
Thin Film Metrology
APPLICATIONS OF X-RAY METROLOGY IN SEMICONDUCTOR MANUFACTURING
IS SURFACE CONTAMINATION AN ISSUE FOR YOUR PROCESS?
WAFER SURFACE CONTAMINATION ANALYSIS
≤ 200 mm Metrology Solutions
TXRF 3800e | Surface contamination typically metals
TXRF 3760 | Surface contamination typically metals
ARE YOU DEALING WITH METAL FILMS, OR ARE YOU INTERESTED IN CHARACTERIZING LIGHT ELEMENTS?
≤ 200 mm Metrology Solutions
WDA-3650 | Wafer/disk analyzer simultaneous WD-XRF spectrometer
XHEMIS® EX-2000 | ED-XRF and XRR for blanket metal layer thickness and composition
XTRAIA® MF-2000 | ED-XRF and XRR for blanket and patterned metal layer thickness and composition
≤ 300 mm Metrology Solutions
TXRF310Fab | TXRF Surface contamination typically metals
TXRF-V310 | Simultaneous VPD and TXRF for the highest throughput
WaferX 310 | Simultaneous WD-XRF spectrometer
XTRAIA® MF-3000 | ED-XRF and XRR for blanket and patterned metal layer thickness and composition
≤ 400 mm Metrology Solutions
AZX 400 | Sequential WD-XRF spectrometer for wafers, media disks, and large samples
IS WAFER-LEVEL PACKAGING AN ISSUE FOR YOUR SEMICONDUCTOR MANUFACTURING PROCESS?
BUMP INSPECTION SYSTEM
≤ 300 mm Metrology Solutions
ONYX 3000 | Hybrid metrology, XRF and optical x-ray, with a 2D microscope, and 3D Scanner for blanket and patterned wafer thickness, composition, defect identification, and sizing
- Hybrid Configuration
- Micro-spot ED-XRF and 2D- and 3D- optical characterization of device structures
- For FEOL, BEOL, and packaging applications
- For up to 300 mm blanket and patterned wafers
ARE YOU INTERESTED IN CHARACTERIZING PATTERNED WAFERS WITH REPEATED STRUCTURES?

Who we are
Rigaku Semiconductor Metrology Division
Semiconductors have the power to change the world for the better. Here at Rigaku, we strive to make this a reality as the leading global supplier of X-ray metrology tools for semiconductor process R&D and high-volume manufacturing.
To contribute to the enhancement of humanity through scientific and technological development.
Value our customers, value our people, and value our technology.