Ensure The Quality And Reliability Of Your Semiconductor Manufacturing Process.

memory

MEMS

POWER DEVICES

ADVANCED PACKAGING

COMPOUND SEMICONDUCTORS

WAFER SURFACE CONTAMINATION ANALYSIS

≤ 200 mm Metrology Solutions

TXRF 3760 | Surface contamination typically metals

≤ 200 mm Metrology Solutions

WDA-3650 | Wafer/disk analyzer simultaneous WD-XRF spectrometer

XHEMIS® EX-2000 | ED-XRF and XRR for blanket metal layer thickness and composition

XTRAIA® MF-2000 | ED-XRF and XRR for blanket  and patterned metal layer thickness and composition

≤ 300 mm Metrology Solutions

TXRF310Fab | TXRF Surface contamination typically metals

TXRF-V310 | Simultaneous VPD and TXRF for the highest throughput

WaferX 310 |  Simultaneous WD-XRF spectrometer

XTRAIA® MF-3000 | ED-XRF and XRR for blanket  and patterned metal layer thickness and composition

≤ 400 mm Metrology Solutions

AZX 400 | Sequential WD-XRF spectrometer for wafers, media disks, and large samples

BUMP INSPECTION SYSTEM

≤ 300 mm Metrology Solutions

ONYX 3000 | Hybrid metrology, XRF and optical x-ray, with  a 2D microscope, and 3D Scanner for blanket and patterned wafer thickness, composition, defect identification, and sizing

• Hybrid Configuration
• Micro-spot ED-XRF and 2D- and 3D- optical characterization of device structures
• For FEOL, BEOL, and packaging applications
• For up to 300 mm blanket and patterned wafers

X-RAY CD METROLOGY TOOLS FOR GRAZING INCIDENT AND TRANSMISSION MEASURMENTS

≤ 300 mm Metrology Solutions

XTRAIA® CD-3000G | XRR for thickness, density, and roughness, GI-SAXS for CD measurements

XTRAIA® CD-3000T | T-SAXS for In-line small-angle x-ray scattering for CD measurements